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High Performance Thermal Conductive Silicone Pad 4W/mk Silicone Insulation Pad
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High Performance Thermal Conductive Silicone Pad 4W/mk Silicone Insulation Pad

Size:
Availability:
  • LMS-TC400

Product Description

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Thermal conductive silicon pad is high-performance, thermal conductive gap filling materials, mainly for the transmission interface between the electronic equipment and heat sink or product outer covering. Nice stickiness, flexibility, good compression performance and excellent heat conductivity are designed for LMS-TC series,which make the products can discharge gas from the electronic original and heat sink, to achieve fully conforming and obviously cooling effect. 



Features & Benefits

● High reliability & High thermal conductivity
● High compressibility, soft and flexible
● High conductivity
● Natural tacky for both sides, no need adhesive
● Meet with the environmental requirements of ROHS and UL


Application Mode

● The filling between PCB and heat sink

● The filling between IC and heat sink or product outer covering

● The filling between IC and heat sink or product outer covering


Typical Applications:

● Communication equipment
● LED Light
● Switching power supply
● Back light model
● Medical equipment
● Mobile equipment
● Video equipment
● Networking equipment
● Household appliances
● Note books




Technical Data Sheet

Test Item
Typical vale
Unit
Standard
Color
Gray/Blue/Pink
-
Visual
Thermal Conductivity
8
W/m.k
ASTM-D5470
Hardness
20±5
Shore A
ASTM-D2240
Thickness
0.3~10
Mm
ASTM-D374
Specific Gravity
2.5~3.5
Mm
ASTM-D2240
Density
2
g/cm³
ASTM-D792
Tensile Strength
2.5
KN/m
ASTM-D412
Breakdown Voltage
>6
KV/mm
ASTM-D149
Flammability Test
V0
V0
UL94
Continuous Use Temperture
-40 ~200
Typical

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