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Heat Dissipation Silicone Pad Cpu/gpu Card Water Cooling Thermal Mat 12.8w/mk 0.5mm 1mm 1.5mm 2mm 3mm
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Heat Dissipation Silicone Pad Cpu/gpu Card Water Cooling Thermal Mat 12.8w/mk 0.5mm 1mm 1.5mm 2mm 3mm

color:pink grey blue
thickness:2 mm
tensile strength:10.4 Mpa
thermal comductivity:1.0~15 W/m.k
rated voltage:>6 KV
continuous use temp:-40~260 ℃
Availability:
  • LMS-TC

  • LMS

Product Description


Product Name
Thermal pad
Test items
LMS-TC test value
Unit
Test method
Color
White or Customized

Visual
Thickness
0.3-20.0
mm
ASTM D374
Density
2.3±3.5
g/cm 3
ASTM D792
Main ingredients
Silicone


Hardness
25-40
Shore C
ASTM D2240
25-40
Tensile Strength
>0.5
Mpe
ASTM D412
Volume Resistivity
>1.8*10 11
Ω.cm
ASTM D257
Continous Use Temp
-60~+200
EN344
Flame Rating
V0

UL-94
Thermal conductivity
1.5~13
W/m.k
ASTM 5470

Thermal conductive silicone sheet has excellent thermal conductivity and electrical insulation performance, which can meet the thermal insulation requirements of most electronic products. Itis a thermal conductiveinterface material that fills the air gap between the heating device and the heat sink or metal base.

◆ Thickness: 0.25-20mm.

Other special thicknesses can be customized according to customer requirements.
◆ Sheet specifications: 200mm * 400mm, 300mm * 300mm
can be cut and stamped according to customer needs.
◆ Roll specification: 300mm * 50m.

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