Feature of Thermal Conductive Insulation Adhesive Back Copper Foil Tape
1.Excellent resistance to heat (dry air), at +260º C continuous and +260º C intermittent.Remains flexible at low temperatures of -40ºC.
2.Resistant to ultra-violet light, ozone and weathering processing,pharma ceutical and cosmetic manufacturing area.
3.Good electrical insulation properties
4.Keep constant even at high temperatures.
5.Resistance to chemicals; moderate resistance to general chemical products.
Application of Thermal Conductive Insulation Adhesive Back Copper Foil Tape
Cooling fin and the heat diffusion film, electronic equipment cooling, Other application need to heat or Conductive, eg: LED light, CPU, GPU, IC, PC...etc.