Product Name
Material
Copper foil, Nanocarbon, Thermal materials
Color
   Black
Size
Customized size
Grade
SGS, ROHS, Reach
Used
  Thermal conductive, high temperature, Led, PC, Heat sink...etc
Thickness
  55um, 75um
Thermal Conductivity
  560w/mk
Glue
  3M

Feature of Thermal Conductive Insulation Adhesive Back Copper Foil Tape

 

1.Excellent resistance to heat (dry air), at +260º C continuous and +260º C intermittent.Remains flexible at low temperatures of -40ºC.
 
2.Resistant to ultra-violet light, ozone and weathering processing,pharma ceutical and cosmetic manufacturing area.
 
3.Good electrical insulation properties
 
4.Keep constant even at high temperatures.
 
5.Resistance to chemicals; moderate resistance to general chemical products.
 

Application of Thermal Conductive Insulation Adhesive Back Copper Foil Tape

 

Cooling fin and the heat diffusion film, electronic equipment cooling, Other application need to heat or Conductive, eg: LED light, CPU, GPU, IC, PC...etc.

Thermal Conductive Insulation Adhesive Back Copper Foil Tape

1. Grade: SGS, REACH, ROHS 2. Size: customized 3. Standard: LMS-TB


product details

Date 2016-11-11 16:45 Brand Name: Laimeisi RoHS PASS Author admin Click times Second
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Our Address

  • Shenzhen Laimeisi Silicon Industry Co. Ltd.
    Floor 2,3 Building,Huarong Industry Park,Dalang street,Longhua New District,ShenZhen City,GuangDong Province